Effect of Solder Layer Void Damage on the Temperature of IGBT Modules

Solder layer void is one of the main failure causes power semiconductor devices, which will seriously affect reliability devices. In this study, a 3D model IGBT (Insulated Gate Bipolar Transistor) packaging was built by DesignModeler. Based on ANSYS Workbench, influence size, location, solder type, and thickness temperature distribution module simulated. The results show that larger radius, higher module. closer to center layer, top corner had greatest impact junction module, shape also factors denser distribution, reduced from 62.656 °C 59.697 using nanosilver paste, overall heat dissipation performance improved 5%. increased linearly with increase in thickness, 0.8 for every 0.025 mm thickness. simulation have guiding significance improving thermal stability modules.